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1、led封裝技術(shù)簡介（led封裝技術(shù)簡介）Thispaperiscontributedbylnan6699PdfdocumentsmayexperiencepoorbrowsingontheWAPside.ItisrecommendedthatyouselectTXTfirstordownloadthesourcefiletothelocalmachine.PackagingstepsandtechnicalessentialsofLEDFirst,theproductionprocess1.produc
2、tion:a)cleaning:useultrasoniccleaningPCBorLEDbracket,anddrying.A:b)inLEDtubecore(wafer)bottomelectrodepreparedonsilvercolloidafterexpansion,willexpandafterthetubecore(wafer)placedinthethorncrystalonthestage,willdieapadinstalledinthePCBorLEDsupportcorresp
3、ondingwiththorncrystalpenunderthemicroscopethen,thesinteredsilvergluecuring.(c)pressurewelding:theelectrodeisconnectedtotheLEDcorebyaluminumwireorwirebonder,whichisusedastheleadofcurrentinjection.LEDdirectlyinstalledonthePCB,generallyusingaluminumwirewel
4、dingmachine.(makingwhiteTOP-LEDneedswireweldingmachine)d)package:protecttheLEDcoreandweldingwirewithepoxythroughdispensing.DispensingonthePCBboardhasstrictrequirementsontheshapeofthegelaftercuring,whichisdirectlyrelatedtothebrightnessofthebacklightproduc
5、t.Thisprocesswillalsoundertakethetaskofpointphosphor(whitelightLED).E)welding:ifthebacklightisusingSMD-LEDorotherencapsulatedLED,theLEDshouldbeweldedtothePCBplatebeforeassemblyprocess.F)cuttingfilm:usingapunchpresscuttingbacklightsourceforavarietyofdiffu
6、sionfilm,reflectivefilm,etc..G)assembly:accordingtotherequirementsofthedrawing,thematerialsofthebacklightareinstalledintherightpositionmanually.H)test:checkthephotoelectricparametersofbacklightandtheuniformityoflightemission.2.packaging:thefinishedproduc
7、tpackagingaccordingtotherequirements,warehousing.Two,packagingtechnologyThetaskof1.LEDpackagingistoconnecttheexternalleadtotheelectrodeoftheLEDchip,andprotecttheLEDchipatthesametime,andplayaroleinimprovingtheefficiencyoflightextraction.Thekeyprocessforas
8、sembling,welding,packaging.2.LEDpackagingformLEDpackagingformcanbesaidtobemultifarious,mainlyaccordingtodifferentapplicationoccasionsadoptthecorrespondingshapesize,heatdissipationCountermeasuresLightemissioneffect.Lamp-LED
