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1、BPCBLayoutApplicationMediaTekWCP/SA/PMWWTsaiBPersonalBackground?8YearsLayoutExperienceinCommunicationField?Skilledinlayoutdevelopmentforcellphoneandnetworkingproduct?LayoutDevelopmentforAllMTKproductBOutline?Stack-upforMTKBBChip?HDIDesignRuleIntroduction?GerberC
2、heckList?MTKLayoutRules?Q&ABStack-upforMTKBBChip4L6L8L(1+N+1)(1+N+1)MT6205●●MT6217●MT6219●MT6226●?盲孔4milMT6227●?埋孔12milMT6228●MT6229●BLayerDefinition4L(1-2/1-4)6L(1-2/2-5/5-6/1-6)8L(1-2/2-7/7-8/1-8)SSSSGSSG/PpGGGSPpPGS(BTG)/SpS(BTP)/SSSL1:ComponentL1:ComponentL1
3、:ComponentL2:Trace/MemoryL2:Trace/MemorytraceL2:Trace/Memorytracetrace/AudiotraceL3:GroundplaneL3:GroundplaneL3:Groundplane/PowerL4:PowerL4:Power/(Audiotrace)L4:Keypad/KeypadL5:AudiotraceL5:Audiotracetrace/LEDtraceL6:Component/notraceL6:TraceL7:TraceL8:Component
4、/notraceBHDIDesignRuleIntroductionInternal/ExternalLayerDesignInternal/ExternalParameterLayerMin.Width/Space4/4milAAAAnnularRingVia+8mil孔環(huán)(A/R4mil)/RAViaLandCoppertoall6milViaLandtraceBDrillingParameterMinimumclearanceNPTHtoAllDrill+7mil(Drill公差為3mil)drillMin.Mi
5、croviatomicro12milviaSpacing(samenet)(via中心至中心)Min.Microviatovia16milSpacing(samenet)(via中心至中心)Min.Drilldiameter12milNormal機鑽孔徑8milMin.Min.LaserDrill4mildiameterBBoardBoardtoAll10miltraceviaplaneSolderMaskParameterMinimumSoldermaskdamA=2milAC綠漆B=3milC=7milBSilks
6、creenParameterMinimumFeatureSilkscreenW/H=50/5文字大小(欲顯示文字勿重疊至銅箔)BGerberCheckList?Net-list–PCB與SCH的net-list是否完全符合–機構及電子零件pin定義是否完全正確?Electroniclayer?PCBrulesLayout層面–Tracetotrace/via/pad最小間距4/4–銅箔與其它最小間距6mil–板邊與其它最小間距10mil–AlltoBoard與其它最小間距10mil–Via是否有重疊(samenet)–
7、走線是否為45度角，避免因直角或銳角產(chǎn)生的雜散電容造成電場幅射–銅箔是否完全為實銅–Via是否有介於綠漆與銅箔之間–電器層是否有2D-line及文字BDrilllayer–PTH、NPTH鑽孔是否正確–挖空區(qū)是否有標示–Viatype是否都有設定，如1-6/1-2/2-5/5-6–N/CDrill程式檔是否都有設定，如1-6/1-2/2-5/5-6?SMTrules零件rules–零件與零件最小間距12mil–零件距Shieldingcase最小間距12mil–BGA/LeadICto其它零件最小間距20mil–Par
8、ttoBoard最小間距20mil–如有TP元件，請勿接至TP再接至其它元件，避免銅箔剝離SolderMask–零件是否都open且單邊加大至少2mil–Shieldingcase是否open–不規(guī)則形狀、圓形易錯BPasteMask–一般零件是否open–DIP零件是否需加強鋼板層–不開鋼板零件：FD、SPARK、TP、Touc
