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1、中自太學(xué)碩±學(xué)&*立ABSTRACTWiththecopperwirebondingasthemainobjectinthepaper,TheinterracialmicrostructuresoftheCu-wirebondingtoanAIpadisobserved,thecompositionofthebondinginterfacecompoundsisdetermined,hebondinginterfacecompoundformationmechanismisanalyzed,andtherelationshipbetweenthecopper
2、bondingprocessbondingtemperature,bondingultrasonicenergy,chipaluminumthicknessandthebondingstrengthisexploredBesidesthereisalargeimpactonchipcantileverbondingprocessinthecopperwirebondingprocess,andthedynamiccharacteristicsofalargereboundandlowintensityofthecopperwirebondingpointTo
3、solvethisprobIem,289mthicknessofthealuminumchipsisproposedinsteadof109rnthicknessofthealuminumchipTheresearchworkincludesthefollowingsections:Firstly,HRTEMtestresultsshowthatuntilthecopperkeyco—temperaturerisesto340。CbeforethecompoundsgeneratedbetweenCu—AIinterfacebondinginterface;
4、X-raydiffractionanalysisshowedthattheCu—AIinterfacetogenerateCuAl2,Cu9A14;AfterCu—AIinterfacecompoundisgenerated,thebondingstrengthandbondingsuccessrateissgnificandvenhancedSecondly,therelationshipbetweenthebondingtemperature,theevolutionofultrasonicenergy,thealuminumtbicknessandbo
5、ndstrength:asthebondingtemperatureincreasedto340。C,thedimpleareaofthebondinginterfaceismoreobvious,morefullybonded,thebondingstrengthhigher;appropriateultrasoundenergy(5mW)ultrasoundenergyisconducivetotheformationofcopperwirebondingstrength,whiletOOlOWortoohighcanleadtocopperwirebo
6、ndingstrength;bondingchipstocoverthe289mthickaluminumfilmcaneffectivelyreducethehardnessvalueofthechiptoimprovethebondingsmoothtoensurethatthecopperwirebondingmorefullytoenhancethequalityofcopperwirebondingThirdlycopperwirebondingprocessf研chipcantileverhasalargeimpact,thedynamiccha
7、racteristicsofthebigreboundandlowintensity中南大學(xué)碩士學(xué)位論文ofthecopperwirebondingpoint,comparethedynamiccharacteristicsofthealuminumfilmthicknessofthechip289mand10umaluminumthicknessofthechipandbondingstrength,theresultsshow:thedynamiccharacteristicsoftheformerismorestable,morepronouncedd
8、impleareamorefullybonded,a