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1、WIREBOND PROCESSINTRODUCTIONCONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡介晶片Die金線GoldWire導線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIM
2、SolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLE銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingT
3、empature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclampXYTableLinear3p
4、haseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmW/HASSYchangeover·Fullyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtop
5、plateenablesfastdeviceEagleBondingSystemBondingMethod?Thermosonic(TS)BQMMode?ConstantCurrent,Voltage,PowerandNormal(Programmable)LoopType?Normal,Low,Square&JXYResolution?0.2umZResolution(capillarytravellingmotion)?2.5umFinePitchCapability?35mmpitch@0.6milwireNo.ofBondingWires?upto1000Progr
6、amStorage?1000programsonHardDiskMultimodeTransducerSystem?Programmableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)EagleVisionSystemPatternRecognitionTime?70ms/pointPatternRecognitionAccuracy?+0.37umLeadLocatorDetection?12ms/lead(3leads/frame)LeadLocatorAccuracy?+2.4umPostBondIn
7、spection?FirstBond,SecondBondWireTracingMax.DieLevelDifferent?400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II)EagleMaterialHandlingSystemIndexingSpeed?200–250ms@0.5“pitchIndexerResolution?1umLeadframePositionAccu
