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1、熱阻論文:基于C-Mount熱沉封裝不同激光器芯片尺寸熱分析【中文摘要】隨著半導(dǎo)體激光器工藝技術(shù)的不斷提高,輸出功率的不斷增加,熱效應(yīng)成為制約大功率半導(dǎo)體激光器發(fā)展主要障礙。其半導(dǎo)體激光器的散熱能力常用熱阻表示。本文制作了條寬為150μm,腔長(zhǎng)為1000μm的半導(dǎo)體激光器,并用In焊料燒結(jié)在C-Mount熱沉上,并進(jìn)行TO-3封裝。用波長(zhǎng)漂移法對(duì)基于C-Mount封裝類型的多只3W激光器的熱阻進(jìn)行了測(cè)量,得出其熱阻為5-3℃/W.5.9℃/W之間。并用ANSYS有限元熱分析軟件在理想條件下對(duì)其進(jìn)行了模擬,從其實(shí)測(cè)和模擬結(jié)果的差異引入了由于焊
2、料層空洞增加的接觸熱阻。并用ANSYS有限元熱分析軟件模擬引入接觸熱阻后的熱阻,其值和實(shí)測(cè)的結(jié)果基本吻合,所以我們用同樣的方法對(duì)C-Mount熱沉封裝的不同芯片尺寸進(jìn)行了模擬。本文又對(duì)3W激光器在不同的占空比下測(cè)量了其溫升值,結(jié)果發(fā)現(xiàn)其在不同的占空比下的溫升是不同的,其中在0.5%占空比條件下其溫升情況為連續(xù)條件的19.6%。并用ANSYS有限元熱分析軟件對(duì)100%占空比下的溫升情況進(jìn)行了模擬,從模擬結(jié)果中可以看出脈沖的特點(diǎn)是激光器在1ms內(nèi)溫升就能達(dá)到穩(wěn)態(tài)時(shí)候的36%,激光器在0.1s就能達(dá)到穩(wěn)態(tài)溫度的95%以上。所以即便激光器在0.5%
3、占空比條件下工作時(shí),其溫升也是不能忽略的?!居⑽恼縒iththedevelopmentofSemiconductorLasertechnologyandtheincreasingoftheoutputpower,thelaserthermaleffectwhichhasbecomethemainobstacletothedevelopmentofhighpowerSemiconductorLasers.Thethermal-resistanceisusuallyusedasthecoolingcapacityofSemiconducto
4、rLasers.Inthispaper,wemadeaSemiconductorLaserwithstripwidthof150μmandcavitylengthof1000μm,whichsinteredonC-MountheatsinkwithInsolder.Atthesametime,wepackagedtheLaserwithTO-3.WemeasuredtheThermal-resistanceofseveral3WLaserswhicharebasedonC-Mountheatsinkwithwavelengthshiftme
5、thod.TheThermal-resistancethatwegetarebetween5.3℃/W-5.9℃/W.WesimulatedtheThermal-resistanceofSemiconductorLaserwithANSYSFiniteelementthermalanalysissoftwareonidealconditions,andweintroductedthecontactresistancecausedbytheemptyinInsolderthroughthemeasuredandsimulatedresults
6、.WeusedANSYSsoftwaresimulatetheThermal-resistanceofLaserafterintroductthecontactresistance,andit’svalueandthemeasuredresultsarebasicallyconsistentWeusedthesamemethodtosimulatetheThermal-resistanceofdifferentchipsizeofLasers,whichbasedonC-Mountheatsink.Inthispaper,wemeasure
7、dthetemperatureriseofdifferentdutycyclesof3WLasers,theresultsshowthatthedifferentdutycycleofthetemperaturerisearedifferent,which0.5%dutycycleisabout20%tocontinuesconditionsoftemperaturerise.WeusedANSYSsoftwaretosimulatethetemperatureriseof100%dutycycle,fromsimulation,andit
8、couldgetthatthetemperatureriseis36%ofthesteadystateinIms.andthetemperatureriseis95%ofthes