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1、HeaderTable_TypeTitle電子深度報告——CMP拋光墊需求旺盛,國產(chǎn)替代可期目錄一.CMP拋光墊是晶圓制造環(huán)節(jié)關鍵材料.....................................................41.1CMP是晶圓制造的核心工藝........................................................................................41.2拋光墊是拋光工藝的技術核心和價值核心..........
2、..........................................................6二.產(chǎn)業(yè)景氣度旺盛拉動拋光墊需求.............................................................82.1全球半導體產(chǎn)業(yè)景氣度旺盛..........................................................................................82.2建廠潮拉動CMP拋光墊
3、需求......................................................................................9三.CMP拋光墊進口替代可期....................................................................123.1拋光墊市場呈現(xiàn)寡頭壟斷格局....................................................................
4、...............123.2國內(nèi)拋光墊產(chǎn)業(yè)進展順利...........................................................................................12投資建議......................................................................................................14風險提示.....................
5、.................................................................................14有關分析師的申明,見本報告最后部分。其他重要信息披露見分析師申明之后部分,或請與您的投資代表聯(lián)系。并請閱讀本證券研究報告最后一頁的免責申明。213679467/30242/2017112010:08HeaderTable_TypeTitle電子深度報告——CMP拋光墊需求旺盛,國產(chǎn)替代可期圖表目錄圖1:晶圓制造流程圖...............
6、...................................................................................................4圖2:平坦化處理對晶片表面影響示意圖......................................................................................4圖3:CMP工作原理..........................................
7、..........................................................................5圖4:CMP工作系統(tǒng)示意圖.........................................................................................................6圖5:拋光墊示意圖......................................................
8、................................................................7圖6:全球半導體銷售額...............................................................................................................8圖7:北美半導體設備制造商