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1、WAFERMOUNTWAFERSAWDIEATTACHEPOXYCUREWIREBONDSemiconductorPackagingProcessMODINGIntegratedCircuit(IC)TRIM/FORMWAFERCONTENTSA.PURPOSEB.PRINCIPLEC.PROCESSD.PACKAGEINTODUCEE.M/CBASICDATAF.MATERIALG.PARAMETERH.DEFECTSI.REFERENCEA.PURPOSEFORMINGASTRONGANDRELIABL
2、EINTERTALLICBONDBETWWEENTHEWIREANDTHEPAD,ASWELLASBETWEENTHEWIREANDTHELEADDICEGOLDWIRELEADFRAMEA.PURPOSEpadleadGoldwireWedgeBond(2ndBond)BallBond(1stBond)B.PRINCIPLEHARDWELDING:PRESSUREAMPLIFY&FREQUENCYWELDINGTIMEWELDINGTEMPATURETHERMOSONICBONDING:THERMALCO
3、MPRESSUREULTRASONICENERGY(1.2MHZ)GLASSCONTAMINATIONVIBRATIONSiO2,TiN,TiWSiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLEC.WIREBONDPROCESSpadleadFreeairballiscaptured inthechamferGOLDBALLFreeairballiscaptured inthechamferpadleadFreeairballiscaptured inthechamfe
4、rpadleadFreeairballiscaptured inthechamferpadleadFreeairballiscaptured inthechamferpadleadFormationofafirstbondpadleadFormationofafirstbondpadleadFormationofafirstbondpadleadheatPRESSUREUltraSonicVibrationFormationofafirstbondpadleadUltraSonicVibrationheat
5、PRESSURECapillaryrisestoloop heightpositionpadleadCapillaryrisestoloop heightpositionpadleadCapillaryrisestoloop heightpositionpadleadCapillaryrisestoloop heightpositionpadleadCapillaryrisestoloop heightpositionpadleadFormationofalooppadleadFormationofaloo
6、ppadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadFormationofasecondbondpadleadheatFormationofasecondbondpadleadheatheatpadleadheatheatpadleadheatheatpadleadpadleadpadleadpadleadpadleadp
7、adleadpadleadDisconnectionofthetailpadleadDisconnectionofthetailpadleadFormationofanewfreeairball
