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1、PCBJargon(PCB專業(yè)術(shù)語)AAbsorption吸收、吸入AcceleratedTest（Aging）加速試驗(yàn)、加速老化Accelerator加速劑、速化劑Accept/Acceptance允收AcceptableQualityLevel（AQL）允收品質(zhì)水準(zhǔn)Accuracy準(zhǔn)確度ACF：Adhesivecopperfoil有膠銅箔Activator活化劑、添加劑比稱為ActivatorActiveparts（Devices）主動零件，指積體電路或電晶體AdditionAgent添加劑Addi
2、tiveProcess加成法、分全加成、半加成及部份加成Adhesion附著力Adhesive膠類或接著劑Aging老化AirKnife風(fēng)刀AmbientTemperature環(huán)境溫度Ampere安培Amp-Hour安培小時AnnularRing孔環(huán)Anode陽極AnodeBag陽極帶ANSI:AmericanNationalStandardInstitute美國標(biāo)準(zhǔn)協(xié)會Anti-FormingAgent消泡劑AOI:AutomaticOpticalInspection自動光學(xué)檢驗(yàn)Aperture開口A
3、PQP:AdvancedProductQualityPlanArray排列、陣列Artwork底片ASIC:ApplicationSpecificIntegratedCircuit特定用途的積體電路器AspectRatio縱橫比、板厚與孔徑之比值A(chǔ)ssembly裝配、組裝ATE:AutomaticTestingEquipment自動電測設(shè)備AVL:ApprovedVenderList合格供應(yīng)商BBackLight（BackLighting）背光法Back-UP墊板Backpanels/Backplane
4、s背板、支持板，厚度較厚，BallGridArray（BGA）球腳車列（封裝）Barrel孔壁BaseMaterial基材Batch批（同時間發(fā)料某一數(shù)量的板子）Bevelling切斜邊Binder黏結(jié)劑Blackoxide黑氧化層，另有棕氧化（BrownOxide）BlindViaHole盲導(dǎo)孔Blister局部性分層或起泡Blockout封網(wǎng)，網(wǎng)板之空網(wǎng)處以水溶膠涂滿BlowHole吹孔，PTH孔壁有破洞（void）所造成Boiler(WaterTubeBoiler/FireTubeBoiler)B
5、OM:BillofMaterial用料表BondStrength結(jié)合強(qiáng)度BondingSheet(Layer)接合片、接著層，指PPBondingWire結(jié)合線，IC之晶片與PCB之引線Bow板彎Break-awayPanel可斷開板或者說BreakAwayTabBreakPoint出像點(diǎn)、影像點(diǎn)Break-Out破出（鉆孔破出開成斷環(huán)情形）Bridging搭橋、橋接Brightener光澤劑BrushPlating刷鍍BTU/BritishThermalUnit英制熱量單位Bump突塊BuriedVi
6、aHole埋導(dǎo)孔Burn-in高溫加速老化試驗(yàn)Burning燒焦Burr毛頭Buy-off認(rèn)可CCAD:ComputerAidedDesign電腦輔助設(shè)計CAM:ComputerAidedManufacturing電腦輔助制造CAT:ComputerAidedTesting電腦輔助測試Capacitance電容Carbide碳化物、碳化鎢鉆頭CAR:CorrectiveActionReport改善報告CarbonTreatment活性碳處理Card卡板Carrier載體Cartridge濾芯Cathod
7、e陰極CCL:CopperCladLaminates銅箔基板Ceramics陶瓷Certificate證明書CFC氟氯碳化物Chloro-Fluoro-CarbonChamfer倒角、去掉直角CharacteristicImpedance特性阻抗Cheeklist檢察清單Chip晶粒、晶片ChipOnBoard晶片黏著板CleanRoom無塵室(Class100)Cleanliness清潔度Clearance余隙、余環(huán)COB（ChiponBoard）晶片在板上直接組裝COC（CertificateofC
8、ompliance）出貨合格書COF（ChiponFlexiblePCB）COG（Chipglass）CoefficientofThermalExpansion熱膨脹系數(shù)（CTE）ColdSolderJoint冷焊點(diǎn)ComponentHole零件孔ComponentSide組件面、零件面Conditioning整孔Conductivity導(dǎo)電度Connector連接器ContinuityTest連通性試驗(yàn)CopperFoil銅箔、銅皮Cop
