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1、電路板朮語總整理電路板術(shù)語總整理*****A*****AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(試驗).Acceleration速化反應(yīng).Accelerator加速劑,速化劑.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy準確度.AcidNu
2、mber(AcidValue)酸值.AcousticMicroscope(AM)感音成像顯微鏡.Acrylic壓克力(聚丙烯酸樹脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化劑.ActiveCarbon活性炭.ActiveParts(Devices)主動零件.Acutance解像銳利度.AdditionAgent添加劑.AdditiveProcess加成法.Adhesion附著力.AdhesionPromot
3、or附著力促進劑.Adhesive膠類或接著劑.Admittance導(dǎo)納(阻抗的倒數(shù)).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.AirInclusion氣泡夾雜.AirKnife風刀.Algorithm算法.AliphaticSolvent脂肪族溶劑.AluminiumNitride(AlN)氮化鋁.AmbientTamp環(huán)境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時.AnalogCircuit/AnalogSignal模擬電路/模擬訊號.AnchoringSp
4、urs著力爪.AngleofContack接觸角.AngleofAttack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal韌化(退火).AnnularRing孔環(huán).Anode陽極.AnodeSludge陽極泥.Anodizing陽極化.ANSI美國標準協(xié)會.Anti-FoamingAgent消泡劑.Anti-pitAgent抗凹劑.AOI自動光學(xué)檢驗.Apertures開口,鋼版開口.AQL品質(zhì)允收水準.AQL(AcceptableQualityLevel)允收品質(zhì)水準
5、.AramidFiber聚醯胺纖維.ArcResistance耐電弧性.Array排列.Artwork底片.ASIC特定用途績體電路器.AspectRatio縱橫比.Assembly組裝裝配.A-stageA階段.ATE自動電測設(shè)備.Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.*****B*****BackLight(BackLighting)背光法.BackTaper反錐斜角.Backpanels,Backplanes支撐
6、板.Back-up墊板.BalancedTransmissionLines平衡式傳輸線.BallGridArray球腳數(shù)組(封裝).Bandability彎曲性.BankingAgent護岸劑.BareChipAssembly裸體芯片組裝.Barrel孔壁,滾鍍.BaseMaterial基材.BasicGrid基本方格.Batch批.Baume波美度(凡液體比重比水重則Be=145-(145÷Sp.Gr)凡液體比重比水輕則Be=140÷(Sp.Gr-130)*Sp.Gr為比重即同體績物質(zhì)對"純水"
7、1g/cm的比值).Beamlead光芒式的平行密集引腳.Bed-of-NailTesting針床測試.BellowsConact彈片式接觸.BetaRayBackscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-LevelStencil]雙階式鋼板.Binder粘結(jié)劑.Bits頭(DrillBits).BlackOxide黑氧化層.Blanking沖空斷開.Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分層或起
8、泡.BlockDiagram電路系統(tǒng)塊圖.Blockout封綱.Blotting干印.BlottingPaper吸水紙.BlowHole吹孔.BluePlaque藍紋(錫面鈍化層).BlurEdge(Circle)模糊邊帶(圈).BombSight彈標.BondStrength結(jié)合強度.Bondability結(jié)合性.BondingLayer結(jié)合層接著層.BondingSheet(Layer)接合片.BondingWire結(jié)合線.Bow,Bowing板彎.Braid編線.Brazin