資源描述：
《hdi印制電路板精細(xì)線路與埋孔制作關(guān)鍵技術(shù)與應(yīng)用》由會(huì)員上傳分享，免費(fèi)在線閱讀，更多相關(guān)內(nèi)容在行業(yè)資料-天天文庫(kù)。
1、ABSTRACTABSTRACTThehighdensityinterconnect(HDI)technology,oneofthemostfashionableprintedcircuitboardproductiontechnologies,iswidelyusedinthefieldssuchascommunications,computer,consumerelectronicsproducts,aerospace,medicalequipmentetc.Itsmaintechnologyistheproductionoffinelinesandmicrovia.Thisp
2、aperismainlyfocusedontheproductionprocessofHDIfinelinesandmicrovia.Accordingtotheexperimentofthefinelinesproductionprocess,thethroughholesandfinelineswithsimultaneouselectroplatingproductionprocessandplugholesproductionprocess,themainresultswereobtainedasfollowing：Duringtheproductionoffineline
3、s,theetchingperformancesofsemi-additiveandimprovedsemi-additivemethodaremoreexcellentthansubtractivemethod,whichhavemoreadvantagesintheproductionoffinelines.Inthetheproductionoffinelinesstudy,4L9(3)orthogonalarrangementwasusedtotaketheorthogonalexperiment,theoptimumsubtractivemethodtechniquepa
4、rameterswereobtainedinthestudy,therateofdevelopingis4.0m/min,theaboveandbelowpressureofthedevelopingis0.18MPaand0.15MPa,respectively.Therateofetchingis4.5m/min,theaboveandbelowpressureofetchingis0.28MPaand0.25MPa,respectively.Inthestudyofthethroughholesandfinelineswithsimultaneouselectroplatin
5、gproductionprocess,bytakingreasonablecontrolofdrillingandholecleaning,imagingtransferring,electrolessplating,PatternPlatingprocessetc.Throughholeswiththicknessat1.5mmanddiameterat200μmholeandfinelineswithwidthandpitchbothat50μmweremanufacturedthroughsimultaneouselectroplating,thepowerofthrowin
6、gisover60%,andthereexistsbindingforcebetweenfinelinesandsubstrate.Aftercomprehensiveconsiderationofthethrowingpowerofthroughholes,thebindingforceoffinelinesandthebrightnessofplating,theoptimumprescriptionoftheelectroplatingliquidwereobtained:theconcentrationsofCuSO4,H2SO4,additiveaandbare45g/L
7、,220g/L,0.6ml/Land20ml/L,respectively.Asforplugholesproductionprocess,resinplugholeandprepregdirectpluggingburiedholeprocesswereinvestigated,respectively.Theresinplugholeprocessresultsdemonstratedthattheholebubblesandresidualmoisture,th
