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1、周驊JI工程2課ACF材料介紹目錄WhatisACFACF之應(yīng)用ACF材料介紹ACF與COG製程參數(shù)之關(guān)係ACF與COG製程品質(zhì)之關(guān)係WhatisACF一.異方性導電膠AnisotropicConductiveFilm二.佈滿導電粒子之熱硬化樹脂膠帶三.提供特定方向之導電功能四.具有良好之接著效果ACF之應(yīng)用PCBPanelChipGlassPCBPanelFPCGlassFPCPCBFPCGlassCOFPCBCOFCOFChipCOFACF材料介紹(forFPC)AC-7106U-25TypeofSeparaterACF厚度1000mm10=1
2、00mmFPCminPitch一.FPCminspace:50μm二.FPCminwidth:50μm三.ConnectionResistance:?2?四.IsulationResistance:?10^12?PanelFPCwidthspaceACF材料介紹(forFPC:7106)五.厚度:25μm(取決於FPC導線之高度,請見續(xù)頁詳述)六.長度:50M七.寬度:2.5mm(取決於FPC壓著區(qū)域之寬度)八.粒子大小:10μm九.粒子密度:800pcs/mm^2十.接著劑:熱硬化樹脂十一.Separater:防靜電PETAuNiPlasticP
3、articleACF材料介紹(forFPC:7106)十二.ACF厚度與FPC的關(guān)係W:conductorwidthS:conductorspaceH:conductorheightT0:ACFthicknessbeforebondingT1:ACFthicknessafterbonding?:correctionvalue(0.15H)FPCT0HSWPanelPanelFPCT1(W+S)*T0=H*S+T1*(W+S)ifW=ST0=H/2+T1+?ACF材料介紹(forCOG:8304)一.厚度:23μm(取決於ICBump之高度,請見續(xù)頁
4、詳述)二.長度:50M三.寬度:2.5mm(取決於IC之寬度)四.粒子大小:5μm五.粒子密度:20000pcs/mm^2六.接著劑:熱硬化樹脂七.Separater:防靜電PET八.DoublelayerAuNiPlasticParticleACF與COG製程參數(shù)之關(guān)係8642002505007501000Time(hr)Connectionresistance(?)170?C190?C210?C10secBonding8642002505007501000Time(hr)Connectionresistance(?)190?C210?C230?
5、C一.製程溫度時間接觸阻抗5secBonding190?C210?C85?C,85%RHACF與COG製程參數(shù)之關(guān)係Connectionresistance(?)8642002505007501000Time(hr)二.製程壓力接觸阻抗25MPa50MPa100MPa200MPa250MPa50~150MPa85?C,85%RHACF與COG製程品質(zhì)之關(guān)係Connectionresistance(?)86420051015Numberofparticle(perBump)一.導電粒子數(shù)接觸阻抗86420051015t=0hrt=500hrs-40
6、?C100?C每個goldbump導電粒子數(shù)須大於5顆ACF與COG製程品質(zhì)之關(guān)係二.導電粒子變形量接觸阻抗Connectionresistance(?)Deformation(%)86420020406080t0=5μmtBumpBumpGlassGlassDeformation=t0-tt0?100%每個導電粒子壓著變形量須大於20%ACF與COG製程品質(zhì)之關(guān)係三.導電粒子變形量判別標準ACF與COG製程品質(zhì)之關(guān)係四.ACF厚度接觸阻抗Connectionresistance(?)86420ACFThickness(μm)86420152025
7、30t=0hrt=500hrs-40?C100?C15202530ACFThickness?Bumpheight+3μm18μmBumpheight:15μmACF與COG製程品質(zhì)之關(guān)係五.Bumphardness接觸阻抗Connectionresistance(?)Time(hr)15~25Hv40~50Hv100~110Hv8642002505007501000Bumphardness?50Hv85?C,85%RH100~110Hv40~50Hv15~25Hv導電粒子未壓破變形導電粒子變形量?20%導電粒子變形量?50%ACF與COG製程品質(zhì)之
8、關(guān)係六.Bumppad導電粒子數(shù)導電粒子密度Numberofconductingparticlesonabump30201