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1、CONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡(jiǎn)介晶片Die金線GoldWire導(dǎo)線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIMSolde
2、rPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLE銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime
3、(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFast
4、responsevoicecoilwireclampXYTableLinear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmW/HASSYchangeover·Fullyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·Outputindexerwithl
5、eadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdeviceEagleBondingSystemBondingMethod?Thermosonic(TS)BQMMode?ConstantCurrent,Voltage,PowerandNormal(Programmable)LoopType?Normal,Low,Square&JXYResolution?0.2umZResolution(capillarytravell
6、ingmotion)?2.5umFinePitchCapability?35mmpitch@0.6milwireNo.ofBondingWires?upto1000ProgramStorage?1000programsonHardDiskMultimodeTransducerSystem?Programmableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)EagleVisionSystemPatternRecognitionTime?70ms/pointPatt
7、ernRecognitionAccuracy?+0.37umLeadLocatorDetection?12ms/lead(3leads/frame)LeadLocatorAccuracy?+2.4umPostBondInspection?FirstBond,SecondBondWireTracingMax.DieLevelDifferent?400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II
8、)EagleMaterialHandlingSystemIndexingSpeed?200–250ms@0.5“pitchIndexerResolution?1umLeadframePositionAccuracy?+2milApplicableLeadfram
