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1、SEMIE21.1-1296N/A?SEMI1992,1996CLUSTERTOOLMODULEINTERFACE300mm:MECHANICALINTERFACEANDWAFERTRANSPORTSTANDARD1IntroductionThestandardprovidestherequirementstoextendthelimitsofSEMIE21from200mmdiameterwafersorsmallerto300mmdiameterwafersorsmaller.2ApplicableDocumentsSEMIE21—ClusterTool
2、ModuleInterface:Mechani-calInterfaceandWaferTransportStandard3RequirementsThestandardisidenticaltoE21(seeApplicationNoteA.1)exceptfortherequirementslistedinTable1andFigures1and2.Table1.MechanicalInterfaceRequirementsfor300mmDiameterWafersE21300mmWaferRequirementsRequirementsTranspo
3、rtMaximumReach1305.0mm380.0mm(12.01in.)(14.96in.)InsideBoundaryWidth-Inter-236.0mm336.0mmfaceSealZone2(9.29in.)(13.23in.)OutsideBoundaryWidth-266.0mm366.0mmInterfaceSealZone2(10.47in.)(14.41in.)WaferTransferZoneMini-222.0mm322.0mmmumWidth2(8.74in.)(12.68in.)AlignmentPinsCenterline3
4、00.0mm400.0mmSeparation2(11.81in.)(15.75in.)FlangeWidth2340.0mm440.0mm(13.39in.)(17.32in.)VerticalSlotOpening(Inner46mm50mmboundaryofSealZone)(1.811in.)(1.969in.)MaximumDistanceofWaferTransfer9.5±.5mm15.5±.5mmPlaneaboveAlignmentPin(0.37±.02in.)(.61±.02in.)DatumLine(seeFigure1)Verti
5、calMotionCapability6±.5mm10±.5mm(seeFigure1)(.24±.02in.)(.39±.02in.)MinimumDistanceofSlot(13mm)23mmTopaboveAlignmentPin(.906in.)DatumonAttachedModulesMinimumDistanceofSlot(13mm)13mmBottombelowAlignmentPin(.512in.)DatumonAttachedModules1.SeeApplicationNoteA.2.2.SeeApplicationNoteA.3
6、.1SEMIE21.1-1296?SEMI1992,1996Figure1Proposed300mmWaferTransportPlaneElevationSEMIE21.1-1296?SEMI1992,19962Figure2Proposed300mmInterfacePlane3SEMIE21.1-1296?SEMI1992,1996NOTICE:Thesestandardsdonotpurporttoaddresssafetyissues,ifany,associatedwiththeiruse.Itistheresponsibilityoftheus
7、erofthesestandardstoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.SEMImakesnowarrantiesorrepresentationsastothesuitabilityofthestandardssetforthhereinforanypar-ticularapplication.Thedeterminationofthesuitabilityofthestanda
8、rdissolelytheresponsibilit
