資源描述：
《PCB印制電路板以及HDI生產(chǎn)流程詳細(xì)介紹.英文版ppt課件.ppt》由會(huì)員上傳分享，免費(fèi)在線閱讀，更多相關(guān)內(nèi)容在教育資源-天天文庫(kù)。
1、PCB以及HDI生產(chǎn)流程詳細(xì)介紹.1AGENDA1.DetailManufacturing4-65ProcessFlow(Photo)HDIProducts2.TechnologyRoadmapforPCB&HDI66-70TechnologyRoadmapProcessCapability2DeltonCONFIDENTIALNONDISCLOSUREDeltonCONFIDENTIALNONDISCLOSUREProcessFlow(PCB&HDI)BACKPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingH
2、olepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingProcessFlowChart(1)4Pre-engineeringPatternimagingEtchingLaminatingDrillingProcessFlowChart(2)5DesmearCuplatingHolepluggingCuplatingBeltSandi
3、ngProcessFlowChart(3)6LaminationLaserAblationMechanicaldrillingCuplatingPatternimagingProcessFlowChart(4)7SolderMaskGoldplatingRoutingElectricaltestPatternimagingProcessFlowChart(5)8HolecounterShippingVisualinspectionProcessFlowChart(6)9*Rawmaterial(ThinCore,Copper,Prepreg…...)RawMaterial:FR-4(Di
4、funtional,Tetrafuntional)Supplier:Nan-Ya,Grace,EMCSheetsize:36.5”*48.8”,40.5”*48.8”,42.5”*48.8”CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2112,2116,1506,7628,7630,RCC101.內(nèi)層基板(THINCORE)LaminateCopp
5、erFoil裁板(PanelSize)COPPERFOILEpoxyGlass11PhotoResist2.內(nèi)層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)12PhotoResist3.內(nèi)層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose134.內(nèi)層線路製作(顯影)(Develop)PhotoResist145.內(nèi)層線路製作(蝕刻)(Etch)PhotoResist156.內(nèi)層線路製作(去膜)(StripResist)167.黑氧化(OxideCoating)
6、178.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)189.壓合(Lamination)19典型之多層板疊板及壓合結(jié)構(gòu)...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機(jī)之熱板壓合機(jī)之熱板COPPERFOIL0.5OZTh
7、inCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板20墊木板鋁板10.鑽孔(Drilling)2111.電鍍Desmear&CopperDeposition2212.塞孔(HolePlugging)13.去溢膠(BeltSanding)2314.減銅(CopperReduction)→Option15.去溢膠(BeltSa
